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| 74LVT240 * 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs July 1999 Revised November 2000 74LVT240 * 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs General Description The LVT240 and LVTH240 are inverting octal buffers and line drivers designed to be employed as memory address drivers, clock drivers and bus oriented transmitters or receivers which provides improved PC board density. The LVTH240 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These octal buffers and line drivers are designed for lowvoltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT240 and LVTH240 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation. Features s Input and output interface capability to systems at 5V VCC s Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH240), also available without bushold feature (74LVT240). s Live insertion/extraction permitted s Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink -32 mA/+64 mA s Functionally compatible with the 74 series 240 s Latch-up performance exceeds 500 mA s ESD performance: Human-body model > 2000V Machine model > 200V Charged-device model > 1000V Ordering Code: Order Number 74LVT240WM 74LVT240SJ 74LVT240MSA 74LVT240MTC 74LVTH240WM 74LVTH240SJ 74LVTH240MSA 74LVTH240MTC Package Number M20B M20D MSA20 MTC20 M20B M20D MSA20 MTC20 Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering code. (c) 2000 Fairchild Semiconductor Corporation DS500153 www.fairchildsemi.com 74LVT240 * 74LVTH240 Logic Symbol IEEE/IEC Pin Descriptions Pin Names OE1, OE2 Description 3-STATE Output Enable Inputs I0-I7 O0-O7 Inputs 3-STATE Outputs Truth Tables Inputs OE1 L In L H X Inputs OE2 L L H H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance Outputs (Pins 12, 14, 16, 18) H L Z Outputs (Pins 3, 5, 7, 9) In L H X H L Z Connection Diagram L H www.fairchildsemi.com 2 74LVT240 * 74LVTH240 Absolute Maximum Ratings(Note 1) Symbol VCC VI VO IIK IOK IO ICC IGND TSTG Parameter Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Value Conditions Units V V Output in 3-STATE Output in HIGH or LOW State (Note 2) VI < GND VO < GND VO > VCC Output at HIGH State VO > VCC Output at LOW State V V mA mA mA mA mA mA -0.5 to +4.6 -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -50 -50 64 128 64 128 -65 to +150 C Recommended Operating Conditions Symbol VCC VI IOH IOL TA Supply Voltage Input Voltage HIGH-Level Output Current LOW-Level Output Current Free-Air Operating Temperature Input Edge Rate, VIN = 0.8V-2.0V, VCC = 3.0V Parameter Min 2.7 0 Max 3.6 5.5 Units V V mA -32 64 -40 0 85 10 C ns/V t/V Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 2: IO Absolute Maximum Rating must be observed. DC Electrical Characteristics Symbol Parameter VCC (V) 2.7 2.7-3.6 2.7-3.6 2.7-3.6 2.7 3.0 VOL Output LOW Voltage 2.7 2.7 3.0 3.0 3.0 II(HOLD) (Note 4) II(OD) (Note 4) II Bushold Input Over-Drive Current to Change State Input Current Control Pins Data Pins IOFF IPU/PD IOZL IOZH Power Off Leakage Current Power up/down 3-STATE Output Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current 3.0 3.6 3.6 3.6 0 0-1.5V 3.6 3.6 Bushold Input Minimum Drive 3.0 75 -75 500 -500 10 1 -5 1 100 100 -5 5 VCC-0.2 2.4 2.0 0.2 0.5 0.4 0.5 0.55 2.0 0.8 T A =-40C to +85C Min Typ (Note 3) VIK VIH VIL VOH Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Output HIGH Voltage -1.2 V V V V V V V V V V A A A A A A A A A A A A II = -18 mA VO 0.1V or VO VCC - 0.1V IOH = -100 A IOH = -8 mA IOH = -32 mA IOL = 100 A IOL = 24 mA IOL = 16 mA IOL = 32 mA IOL = 64 mA VI = 0.8V VI = 2.0V (Note 5) (Note 6) VI = 5.5V VI = 0V or VCC VI = 0V VI = VCC 0V VI or VO 5.5V VO = 0.5V to 3.0V VI = GND or VCC VO = 0.5V VO = 3.0V Max Units Conditions 3 www.fairchildsemi.com 74LVT240 * 74LVTH240 DC Electrical Characteristics Symbol IOZH+ ICCH ICCL ICCZ ICCZ+ ICC Parameter 3-STATE Output Leakage Current Power Supply Current Power Supply Current Power Supply Current Power Supply Current Increase in Power Supply Current (Note 7) Note 3: All typical values are at VCC = 3.3V, TA = 25C. Note 4: Applies to bushold versions only (74LVTH240). (Continued) T A =-40C to +85C Min Typ (Note 3) 3.6 3.6 3.6 3.6 3.6 3.6 10 0.19 5 0.19 0.19 0.2 A mA mA mA mA mA VCC < VO 5.5V Outputs HIGH Outputs LOW Outputs Disabled VCC VO 5.5V, Outputs Disabled One Input at VCC - 0.6V Other Inputs at VCC or GND Max Units Conditions VCC (V) Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND. Dynamic Switching Characteristics (Note 8) Symbol VOLP VOLV Parameter Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL VCC (V) 3.3 3.3 Min TA = 25C Typ 0.8 -0.8 Max Units V V Conditions CL = 50 pF, RL = 500 (Note 9) (Note 9) Note 8: Characterized in SOIC package. Guaranteed parameter, but not tested. Note 9: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. Output under test held LOW. AC Electrical Characteristics TA = -40C to +85C CL = 50 pF, RL = 500 Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tOSHL tOSLH Output to Output Skew (Note 11) Output Disable Time Output Enable Time Propagation Delay Data to Output 1.1 1.3 1.1 1.4 2.0 1.8 VCC = 3.3V 0.3V Typ (Note 10) 3.8 4.0 4.6 4.4 4.5 4.3 1.0 1.1 1.3 1.1 1.4 2.0 1.8 4.6 4.2 5.6 5.1 4.7 4.3 1.0 ns ns ns ns Max VCC = 2.7V Min Max Units Note 10: All typical values are at VCC = 3.3V, TA = 25C. Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Capacitance (Note 12) Symbol CIN COUT Parameter Input Capacitance Output Capacitance Conditions VCC = 0V, VI = 0V or VCC VCC = 3.0V, VO = 0V or VCC Typical 3 6 Units pF pF Note 12: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012. www.fairchildsemi.com 4 74LVT240 * 74LVTH240 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Package Number M20B 5 www.fairchildsemi.com 74LVT240 * 74LVTH240 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 6 74LVT240 * 74LVTH240 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 7 www.fairchildsemi.com 74LVT240 * 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 8 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com |
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